Fortaki, Tarek, University of Mostefa Ben Boulaid, Algeria

• Vol 8, No 3: June 2018 - Telecommunication System and Technology
  Effect of the Thickness of High Tc Superconducting Rectangular Microstrip Patch over Ground Plane with Rectangular Aperture
  Abstract  PDF

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International Journal of Electrical and Computer Engineering (IJECE)
p-ISSN 2088-8708, e-ISSN 2722-2578

This journal is published by the Institute of Advanced Engineering and Science (IAES) in collaboration with Intelektual Pustaka Media Utama (IPMU).