Kumari, Pinki, GJU S&T HISAR, India

• Vol 10, No 1: February 2020 - Special_Invitation
  Reducing the hygroscopic swelling in MEMS sensor using different mold materials
  Abstract  PDF

This work is licensed under a Creative Commons Attribution-ShareAlike 4.0 International License.

International Journal of Electrical and Computer Engineering (IJECE)
p-ISSN 2088-8708, e-ISSN 2722-2578

This journal is published by the Institute of Advanced Engineering and Science (IAES) in collaboration with Intelektual Pustaka Media Utama (IPMU).