Design of microstrip patch antenna to deploy unmanned aerial vehicle as UE in 5G wireless network

Abu Zafar Md. Imran, Mohammad Lutful Hakim, Md. Razu Ahmed, Mohammad Tariqul Islam, Elias Hossain

Abstract


The use of unmanned aerial vehicle (UAV) has been increasing rapidly in the civilian and military applications, because of UAV's high-performance communication with ground clients, especially for its intrinsic properties such as adaptive altitude, mobility, and flexibility. UAV deployment can be monitored and controlled through 5G wireless network as user equipment (UE) along with other devices. A highly directive microstrip patch antenna (MPA) could establish long-distance communication by overcoming air attenuation and reduce co-channel interference in the limited region if UAV uses a specifically dedicated band, which might enhance spatially reuse of the spectrum. Also, MPA is highly recommended for UAV because of its low weight, low cost, compact size, and flat shape. In this paper, we have designed a highly directive single-band 2×2 and 4×4 antenna array for 5.8 GHz and 28 GHz frequency respectively for UAV application in a focus to deploy UAV through 5G wireless network. Here, The Roger RT5880 (lossy) material utilize as a substrate due to its lower dielectric constant which achieves higher directivity and good mechanical stability. Inset feed technique used to feed antenna for lowering input impedance which provides higher antenna efficiency. The results show a wider bandwidth of 702 MHz and 1.596 GHz for 5.8 GHz and 28 GHz antenna array correspondingly with a compact size.

Keywords


5G wireless communication; high-directivity; microstrip patch antenna array; UAV;

Full Text:

PDF


DOI: http://doi.org/10.11591/ijece.v11i5.pp4202-4213

Creative Commons License
This work is licensed under a Creative Commons Attribution-ShareAlike 4.0 International License.

International Journal of Electrical and Computer Engineering (IJECE)
p-ISSN 2088-8708, e-ISSN 2722-2578

This journal is published by the Institute of Advanced Engineering and Science (IAES) in collaboration with Intelektual Pustaka Media Utama (IPMU).